Precise mechanical structure design
Fixture design: The fixture for the peeling system is a key component. The shape and material of the fixture are carefully designed based on the physical characteristics of the starting substrate and the seed board. For example, the edges of the fixture are usually wrapped with soft materials (such as rubber or polyurethane) to provide sufficient friction when clamping the starting substrate, preventing it from slipping, while also avoiding scratches on the surface of the starting substrate due to overly hard contact.
Peeling angle optimization: The angle during peeling is precisely calculated and verified through extensive experiments. An appropriate angle allows for a uniform stress distribution on the starting substrate during the peeling process. Generally, the peeling angle is adjusted based on factors such as the material and thickness of the starting substrate and the surface characteristics of the seed board. For instance, for thinner starting substrates, the peeling angle may be relatively small to reduce the tensile force during peeling and avoid tearing of the starting substrate.
Advanced control system
Force feedback control: Modern peeling systems are typically equipped with force sensors that can monitor the force during the peeling process in real-time. When the sensor detects that the force exceeds a preset safety threshold, the control system immediately adjusts the peeling action. For example, if the force sensor detects excessive peeling force, the control system will pause the peeling action or reduce the peeling speed to prevent damage to the starting substrate due to excessive force.
Speed control: Peeling speed is also an important parameter. The control system can precisely adjust the peeling speed based on the specific conditions of the starting substrate. For more fragile starting substrates, the peeling speed will be appropriately slowed down. For example, when peeling some starting substrates with a loose surface crystallization, a slower peeling speed allows the starting substrate enough time to detach from the seed board, avoiding crystal shedding or substrate breakage due to excessive speed.
Intelligent recognition and compensation mechanism
Starting substrate state recognition: Some high-end peeling systems are equipped with visual recognition systems. Through devices such as cameras, the system can identify the surface state of the starting substrate (such as whether there are cracks or local thickness irregularities). Based on the recognition results, the system can adjust the peeling strategy. For example, if cracks are found on the surface of the starting substrate, the system will reduce the peeling force near the cracks and adopt a gentler peeling method to prevent the cracks from expanding.
Compensation mechanism: When the system detects signs of slight deformation or local damage to the starting substrate during the peeling process, it will activate the compensation mechanism. For example, by adjusting the clamping position or force of the fixture, the system can correct the deformation of the starting substrate or apply a more refined peeling method to the locally damaged area, such as reducing the peeling angle and speed, to ensure the overall integrity of the starting substrate.